منابع مشابه
Wafer Slicing and Wire Saw Manufacturing Technology
Wire saw, with its ability to cut very thin wafers from large diameter crystalline ingots of semiconductor materials, has emerged as a leading technology for wafer production in semiconductor and photovoltaic industry. Nevertheless, the wire saw cutting process remains lacking a theoretical methodology and is not properly understood. The modern times compulsion of more accurate and efficient ma...
متن کاملExperimental Study on Slicing of Sapphire with Fixed Abrasive Diamond Wire Saw
Experimental study on slicing of sapphire with fixed abrasive diamond wire saw was conducted in this paper. The process parameters were optimized through orthogonal experiment of three factors and four levels. The effects of wire speed, feed speed and tension pressure on the surface roughness were analyzed. Surface roughness in cutting direction and feed direction were both detected. The result...
متن کاملDevelopment of Multi-wire Edm Slicing Method for Silicon Ingot
INSTRUCTIONS The diameter of silicon wafer becomes larger in order to increase the number of chips per one wafer. For such a larger diameter silicon ingot is mainly sliced by using multi-wire method, in which a long thin wire is used with slurry. In this method, several hundreds of wafers could be sliced at the same time. However there are still problems remained, such as large cracks, slurry t...
متن کاملApplication of harmony search algorithm to evaluate performance of diamond wire saw
Evaluation and prediction of performance of diamond wire saw is one of the most important factors involved in planning the dimension stone quarries. The wear rate of diamond wire saw can be investigated as a major criterion to evaluate its performance. The wear rate of diamond wire saw depends upon non-controlled parameters related to rock characteristics and controlled parameters related to ch...
متن کاملMulti-direction Slicing of Stl Models for Robotic Wire-feed Additive Manufacturing
Robotic wire-feed additive manufacturing technology is possible to directly fabricate metallic overhangs without support structures through multi-direction deposition. To automatically produce complex components with overhangs, an efficient multi-direction slicing algorithm to slice CAD models into a set of proper layers is required. This paper reports the concept and implementation of a new st...
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ژورنال
عنوان ژورنال: Journal of the Japan Society for Precision Engineering
سال: 2007
ISSN: 1882-675X,0912-0289
DOI: 10.2493/jjspe.73.61